A circular spot reflow test was performed: 1 mm thick Cymcap plates were coated with Sn–3.0Ag–0.5Cu solder paste and subjected to a lead-free reflow profile (ramp 2°C/s to 260°C, hold 10 s, cool at 3°C/s). Cracking was assessed by dye penetrant inspection and cross-section SEM.
If using a dry-out zone model, check the critical temperature ( Tcritcap T sub c r i t end-sub Tcritcap T sub c r i t end-sub
Understanding Cymcap and the “Hot Crack” Issue in Underground Cabling
In cracked regions, EDS identified Mn-rich intermetallic phases (CuMn₃Ni) and trace P segregation at grain boundaries. These low-melting-point constituents solidify last and serve as crack propagation paths under tension.
A circular spot reflow test was performed: 1 mm thick Cymcap plates were coated with Sn–3.0Ag–0.5Cu solder paste and subjected to a lead-free reflow profile (ramp 2°C/s to 260°C, hold 10 s, cool at 3°C/s). Cracking was assessed by dye penetrant inspection and cross-section SEM.
If using a dry-out zone model, check the critical temperature ( Tcritcap T sub c r i t end-sub Tcritcap T sub c r i t end-sub cymcap hot crack
Understanding Cymcap and the “Hot Crack” Issue in Underground Cabling A circular spot reflow test was performed: 1
In cracked regions, EDS identified Mn-rich intermetallic phases (CuMn₃Ni) and trace P segregation at grain boundaries. These low-melting-point constituents solidify last and serve as crack propagation paths under tension. hold 10 s