Ipc-7095 Pdf Jun 2026

The standard provides a "thermal warpage" test. Place a glass BGA dummy on a board. Run it through reflow. If the glass breaks or shows stress marks, your PCB or component is warping too much (as defined in Appendix C).

Design and Assembly Process Guidance for Ball Grid Arrays (BGAs) ipc-7095 pdf

Outlines requirements for stencil design, paste volume, and placement accuracy (e.g., ±35 µm for 0.5 mm pitch). The standard provides a "thermal warpage" test