on the TX line to ground to enable communication with certain flasher boxes. ball-by-ball map
Common package sizes include:
UFS 3.1 chips typically use a Ball Grid Array (BGA) package, with the most common being and BGA 254 . 1. BGA 153 Pinout (Standard Mobile/Embedded) ufs 3.1 pinout
💡 If you are doing board rework, check the CMD and RST_N lines first if the device isn't enumerating. on the TX line to ground to enable